食品科学 ›› 2008, Vol. 29 ›› Issue (4): 78-81.

• 基础研究 • 上一篇    下一篇

大豆酱欧姆加热影响因素的初步研究

 程玉来, 陈波   

  1. 沈阳农业大学食品学院; 沈阳农业大学食品学院
  • 出版日期:2008-04-15 发布日期:2011-08-24

Preliminary Study on Affecting Factors in Soybean Sauce Omic Heating

 CHENG  Yu-Lai, CHEN  Bo   

  1. College of Food Science,Shenyang Agricultural University
  • Online:2008-04-15 Published:2011-08-24

摘要: 研究了不同欧姆加热条件对大豆酱电导率、加热速率以及酵母菌杀菌效果的影响。实验结果表明:大豆酱的加热速率随着电压、盐含量的增大和固形物含量降低而增大,大豆酱的电导率与温度呈线性关系;正交试验确定最佳杀菌条件:65℃、150s、35V;在此条件下,能全部杀灭大豆酱中的酵母菌,电能消耗功率约为785J/kg*s。

关键词: 欧姆加热, 大豆酱, 加热速率, 电导率, 酵母菌, 残菌率

Abstract: This article mainly studied the effect of different conditions on the heating speed, electrical conductivity and the sterilization of yeast in the soybean sauce. The experimental results indicated that the heating rate of the soybean sauce increased with increase of the voltage and the salt content and decrease of solid content. The soybean sauce electrical conductivity and the temperature had the linear relation. Orthogonal test confirmed the best sterilization condition: 35 V, 65 ℃ 150 s. Under these conditions, it could completely exterminated the yeast in the soybean sauce, and the consuming power of electrical energy was 785 J/ kg·s.

Key words: omic heating, soybean sauce, heating rate, electrical conductivity, yeast, survival rate